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MOQ : 1
Price : Send us Gerber file for free quotation
Payment Terms : T/T
Layer : 18 Layer
Material : PTEF+FR4
Thickness : 2.0 mm
Min. Line Width/Space : 0.1/0.1mm
Copper Thickness : 1.2OZ
Surface treatment : Immersion Gold
Application : Power Detection System
Certificate : UL & IPC Standard & ISO
Strong Impedance Control High Frequency PCB Power Detection System
♦ What's High-Frequency PCB?
High-frequency PCB is a special circuit board designed for high-frequency electromagnetic scenes, suitable for high-frequency (frequency>300MHz, corresponding to wavelength <1 meter) and microwave (frequency>3GHz, corresponding to wavelength <0.1 meter) fields. It is based on microwave substrate copper clad laminate, combined with some processes of ordinary rigid circuit board manufacturing, or made through special processing.
♦ Features of High-Frequency PCB
Special materials: use low Dk/Df substrates such as PTFE, ceramic filling materials, LCP, etc. to reduce signal attenuation (PTFE is the first choice for 5G).
Precise transmission: impedance control of ±5%, micron-level line accuracy, 30%+ loss reduction in millimeter wave band, and excellent phase stability.
Complex process: laser drilling accuracy of ±3μm, plasma etching instead of pickling, multi-layer board integrated passive devices, and high-yield production in dust-free workshops.
♦ High-frequency PCB design principles
Material selection: low Dk (such as PTFE), low Df materials, matching frequency requirements, taking into account thermal stability and copper foil bonding.
Wiring rules: 45° routing, equal-length differential pairs, short and straight paths, control line width/spacing, reduce crosstalk and reflection.
Power ground design: multi-layer board power/ground layers are adjacent, decoupling capacitors are added nearby, and analog/digital ground is isolated by partition.
Stacking structure: 4 layers or more are preferred, and the middle layer is used as the power/ground plane to reduce parasitic parameters and shorten the signal path.
♦ Technical Parameters
| Item | Specification |
| Laers | 1~32 |
| Board thickness | 0.1mm-7.0mm |
| Material | FR-4,CEM-1/CEM-3,PI,High Tg,Rogers |
| Max panel size | 32"×48"(800mm×1200mm) |
| Min hole size | 0.075mm |
| Min line width | 3mil(0.075mm) |
| Surface finish | OSP,HASL,Imm Gold/Nickel/Ag, Electric gold |
| Copper thickness | 0.5-7.0OZ |
| Soldermask | Green/Yellow/Black/White/Red/Blue |
| Silkscreen | Red/Yellow/Black/White |
| Min PAD | 5mil(0.13mm) |
| Inter package | Vacuum |
| Outer package | Carton |
| Outline tolerance | ±0.75mm |
| Hole tolerance | PTH:±0.05 NPTH:±0.025 |
| Certificate | UL,ISO 9001,ISO14001,IATF16949 |
| Special request | Blind hole+Gold finger + BGA |
| Material Suppilers | Shengyi, KB, Nanya, ITEQ,etc. |
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2mm PTEF FR4 High Frequency PCB Copper Circuit Board Mass Production Images |